Alexander S. Langsdorf Fellowships

  • Up to 10 full-tuition fellowships with a $1,000 stipend
  • Renewable annually, as long as the scholar is making satisfactory progress toward a degree.

McKelvey School of Engineering offers Alexander S. Langsdorf Fellowships to entering first-year students who demonstrate outstanding academic achievement, particularly in science and mathematics. Selected students participate in special programming as engineering undergraduates. For more information, please visit the Engineering website.

Eligibility

Each McKelvey School of Engineering applicant will be considered. No separate scholarship application is required. Langsdorf Fellows are notified by the end of February.

To apply

  • Select the McKelvey School of Engineering as the Academic Division on your application for admission to the Class of 2027.

Deadlines

All applications must be submitted by January 4, 2023.

James M. McKelvey Undergraduate Research Award

  • Up to eight awards of $5,000 each to be used for research expenses and salary

If you’re an aspiring researcher, you may be interested in the James M. McKelvey Undergraduate Research Award, which supports research expenses and salary for working with any faculty member in engineering, medicine, or science. McKelvey Research Scholars may take advantage of special programming and mentoring throughout their undergraduate career, and they participate in a research seminar during the spring semester of their first year. McKelvey Research Scholars are encouraged to spend at least one summer in St. Louis engaged in research.

Eligibility

Each McKelvey School of Engineering applicant will be considered. No separate scholarship application is required.

Scholars generally score in the top ranges on the SATs or ACTs. Most are in the top 10 percent of their classes in high school and have followed an extremely rigorous curriculum.

To apply

  • Select the McKelvey School of Engineering as the Academic Division on your application for admission to the Class of 2027.

Deadlines

All applications must be submitted by January 4, 2023.